- Academics
- Quick Links
Professor Yildirim Hürmüzlü, Chair
Professor Radovan Kovacevic, director, Research
Center for Advanced Manufacturing
Professors: Yildirim Hürmüzlü, Radovan Kovacevic, José L. Lage, Bijan Mohraz, Peter E. Raad, Wei Tong. Associate Professors: Paul S. Krueger, Charles M. Lovas, David A. Willis. Assistant professor: Gemunu S. Happawana. Senior Lecturer: Dona T. Mularkey. Lecturers: Elena Borzova, Donald C. Price. Adjunct Faculty: Bogdan Antohe, Eric B. Cluff, Santos Garza, Raymond E. Goforth, David J. Nowacki, Edmond Richer, Allen D. Tilley. Emeritus Professors: Charles E. Balleisen, David B. Johnson, Jack P. Holman, Paul F. Packman, Hal Watson Jr.
Mechanical Engineering is a very diverse, dynamic and exciting field. Because of the wide-ranging technical background they attain, mechanical engineers have the highest potential for employment after graduation and the exceptional mobility that’s needed for professional growth even during bear-market conditions.
The mechanical engineering department at SMU has a long tradition of offering a superb engineering education within an environment that fosters creativity and innovation. Small classes, a trademark of our program, not only allow for strong mentoring but also foment academic excellence through cooperation and teamwork. Our exceptionally qualified faculty members are continuously engaged in cutting-edge research projects, facilitating the attainment and transmission of knowledge to the students. Leading by example, through encouragement and dedication, the faculty is committed to the success of every student during his or her tenure at SMU and after graduation.
The SMU program genuinely prepares students to be creative by providing a solid background in fundamentals of science and engineering without compromising the practical aspects of mechanical engineering. Essential entrepreneurial know-how, interpersonal skills and an understanding of the importance of lifelong learning complement the educational experience of SMU students. The program stimulates professional and social leadership by providing, among others, opportunities for students to participate in the SMU student section of the American Society of Mechanical Engineers.
Master of Science in Mechanical Engineering
Master of Science (Major in Manufacturing Systems Management)
Master of Science (Major in Packaging of Electronic and Optical Devices)
Doctor of Philosophy (Major in Mechanical Engineering)
Mechanical engineers apply their creative knowledge to solve critical problems in several different areas, such as bio-engineering (e.g., drug delivery; artificial organs, prosthetics and orthotics), construction, design and manufacturing, electronics, energy (e.g., production, distribution and conservation), maintenance (individual machinery and complex installations), materials processing, medicine (diagnosis and therapy), national security and defense, packaging, pollution mitigation and control, robotics and automation, sensors, small scale devices and all aspects of transportation including space travel and exploration.
In addition to meeting the School of Engineering admission requirements
for a Master of Science degree, applicants are required to satisfy the following
additional requirement:
Bachelor of Science in mechanical engineering or a closely related discipline
In addition to meeting the School of Engineering degree requirements for a Master of Science degree, candidates are required to satisfy the following additional requirements:
The Master’s thesis must attain a certain level of originality to be considered “independent” work and be presented to, and approved by, a committee that includes at least three members and is chaired by the adviser. Students are required to take five courses (15 term credit hours) from one of the three existing areas of concentration. They also are allowed to take no more than a total of three courses (nine term credit hours) from manufacturing systems management and packaging of electronic and optical devices programs. The choice of courses must be approved by the student’s adviser. These requirements provide depth and breadth to the academic experience of students. The available core areas are:
Design and Dynamic Systems and Controls:
ME 7302 (EE 7362) Linear System Analysis
ME 7320 Intermediate Dynamics
ME 7322 Vibrations
ME 7326 Vehicle Dynamics
ME 7337 Introduction to Computational Fluid Dynamics
ME 7355 Integrated Design and Manufacturing
ME 7356 Human Factors in Design and Manufacturing
ME 7358 Design of Electronic Packaging
ME 7372 Introduction to CAD
ME 8367 (EE 8367) Nonlinear ControlMechanical Science:
ME 7319 Advanced Mechanical Behavior of Materials
ME 7320 Intermediate Dynamics
ME 7322 Vibrations
ME 7323 Introduction to Fracture Mechanics
ME 7324 Fatigue Theory and Design
ME 7340 Introduction to Solid Mechanics
ME 7361 Matrix Structural Analysis
ME 7364 Introduction to Structural Dynamics
ME 8364 Finite Element Methods in Structural and Continuum MechanicsThermal and Fluid Sciences:
ME 7330 Heat Transfer
ME 7331 Advanced Thermodynamics
ME 7332 Heat Transfer in Biomedical Sciences
ME 7333 Transport Phenomena in Porous Media
ME 7336 Intermediate Fluid Dynamics
ME 7337 Introduction to Computational Fluid Dynamics
ME 7342 Mechanical Engineering Aspects of Electronic Packaging
ME 7358 Design of Electronic Packaging
ME 7383 Heating, Ventilating and Air Conditioning
ME 7386 Convection Heat Transfer
ME 8385 Conduction Heat Transfer
ME 8387 Radiation Heat Transfer
The best students enrolled in this Master’s program are encouraged to participate in research projects conducted by the School of Engineering faculty and to consider extending their studies toward a Ph.D. degree in mechanical engineering at SMU or elsewhere.
Manufacturing is undergoing rapid change. Global competition, rapid advances in manufacturing technology, integration across the enterprise and an expanding role for software are putting pressure on manufacturing businesses from the Fortune 500 to small job shops. Success now requires manufacturing professionals with up-to-date knowledge and skills in these rapidly evolving fields.
Developed in consultation with business and industry leaders and professionals in manufacturing, the SMU M.S. MSM program is unique in providing both the latest in technology and the broad management skills needed for success in today’s business. The interdisciplinary program prepares manufacturing professionals to lead their company in the integration of the entire product commercialization process–including concept, design, manufacturing process development, production and distribution. The program provides a broad set of business skills to manage this integrated process including strategies, globalization, project management and quality.
In addition to meeting the School of Engineering admission requirements for a Master of Science degree, applicants are required to have a Bachelor of Science in one of the engineering disciplines or a closely related scientific field.
In addition to meeting the School of Engineering degree requirements for a Master of Science degree, candidates are required to satisfy these additional requirements:
These 10 courses are required:
ME 7301 Entrepreneurship and Business Development in Manufacturing
ME 7303 Organizational Leadership
ME 7351 Computer Integrated Manufacturing Systems
ME 7352 Modern Manufacturing Methods and Systems
ME 7353 Manufacturing Management
ME 7354 Lean Manufacturing and Six Sigma
ME 7365 Strategies for Manufacturing Firms
ME 7366 Global Manufacturing
ME 7369 Innovation Management
ME 7382 Finance and the Manufacturing Enterprise
A professional certificate may be earned upon the successful completion of three courses selected from this list of four core courses:
ME 7301 Entrepreneurship and Business Development in Manufacturing
ME 5/7303 Organizational Leadership
ME 5/7353 Manufacturing Management
ME 5/7382 Finance and the Manufacturing Enterprise
Students must have an undergraduate degree in science or engineering or five years of directly relevant professional experience.
Students who complete the requirements for the professional certificate and meet the admission requirements can apply for admission as a degree-seeking student in the graduate degree program in manufacturing systems management.
For those students accepted into the graduate degree program, the courses taken to complete the professional certificate will count toward the graduate degree requirements.
The professional certificate will be awarded upon completion of three of the four core courses with a grade of B or better in each of the three courses.
The three courses for the professional certificate must be completed within three years from admission to the program.
Electronic and optical devices continue their rapid evolution with advanced functionality, smaller individual features and increased complexity. Each step up in the capability of the devices demands ever more creative packages to enable effective communication outside the device, dissipation of increasing amounts of heat and protection of the sensitive device from the environment.
The electronic industry needs packaging engineers with broad technical capabilities. The best packaging engineers have in-depth expertise in mechanics, thermal management, electrical behavior and materials. They also have an understanding of the semiconductor devices being packaged and the manufacturing techniques used to make and package them.
This program, developed with input from leaders in the electronics industry, provides this in-depth technical expertise. The four courses cover mechanical aspects of packages, thermal management, electrical characterization, materials effects, design techniques, reliability, semiconductor fundamentals and manufacturing technologies. Students can select from a variety of elective courses in areas such as MEMS, design of optoelectronics and fiber optic communications. They will gain knowledge about the leading edge research that is pushing the state-of-the-art in packaging technology and about the practical challenges that the industry is now facing.
In addition to meeting the School of Engineering admission requirements for a Master of Science degree, applicants are required to have a Bachelor of Science in one of the engineering disciplines or in a closely related scientific field.
In addition to meeting the School of Engineering degree requirements for a Master of Science degree, candidates are required to satisfy the following additional requirements:
1. Satisfactory completion of the required core curriculum consisting of these four courses:
ME 7334 Fundamentals of Electronic Packaging
ME 7342 Introduction to Thermal Management of Electronics
ME 7343 Electronic Packaging Materials: Processes, Properties and Testing
ME 7358 Vibration Analysis of Electronic Systems
2. Satisfactory completion of five electives chosen from approved electronic packaging specialization courses such as:
ME 7314 Introduction to Microelectromechanical Systems and Devices (MEMs)
ME 7335 Convective Cooling of Electronics
ME 7344 Conductive Cooling of Electronics
ME 7346 Application of Computational Techniques to the Mechanical and Thermal Design of Electronic Systems
ME 7348 Thermal, Fluid and Mechanical Measurements in Electronics
ME 7359 Analysis and Design of Optoelectronic Packaging
ME 7360 Electronic Product Design and Reliability
3. Satisfactory completion of one elective from this list of courses:
ME 7354 Lean Manufacturing and Six Sigma
ME 7363 Electronic Manufacturing Technology
ME 7368 Project and Risk Management
A professional certificate may be earned upon the successful completion of three courses selected from the following list of four core courses:
ME 5/7334 Fundamentals of Electronic Packaging
ME 5/7342 Introduction to Thermal Management of Electronics
ME 5/7343 Electronic Packaging Materials: Processes, Properties and Testing
ME 5/7358 Vibration Analysis of Electronic Systems
Students must have an undergraduate degree in science or engineering or five years of directly relevant professional experience.
Students who complete the requirements for the professional certificate and meet the admission requirements can apply for admission as a degree-seeking student in the graduate degree program in packaging of electronics and optical devices.
For
those students accepted into the graduate degree program, the courses taken
to complete the professional certificate will count toward the graduate degree
requirements.
The professional certificate will be awarded upon completion of three of the four core courses with a grade of B or better in each of the three courses.
The three courses for the professional certificate must be completed within three years from admission to the program.
Our Ph.D. program is one of the most successful programs in the nation. The majority of our students are supported by their own companies, by faculty research grants or by the department through teaching assistant fellowships. The latter option is specifically tailored to students interested in obtaining a faculty position after graduation.
1. Master of Science degree in mechanical engineering or in a closely related discipline from a U.S. college or university accredited by a regional accrediting association or completion of an international degree that is equivalent to a U.S. Master’s degree from a college or university of recognized standing
2. Excellent academic performance in all completed coursework, with a G.P.A. of at least 3.00 on a 4.00 scale
3. Submission of a complete application, including a statement of purpose, official transcripts for all previous undergraduate and graduate studies and payment of appropriate application fee
4. Official Graduate Record Examination (GRE) quantitative score of 650 or greater
5. Three letters of recommendation from individuals who can judge the applicant’s potential success as a doctoral student
6. Graduates from foreign countries are required to submit a notarized financial certification form. All international students whose native language is not English and who have not graduated from an American university must submit a minimum TOEFL score before being considered for admission as follows:
In addition to meeting the School of Engineering requirements for the Doctor of Philosophy degree, candidates are required to satisfy the following:
The basic requirements of our program are:
The mission of our laboratories is to support high-quality practical research and technological innovations.
Computational Graphics, Analysis and Design Laboratory. These dedicated computational facilities include personal computers and high-resolution color X-Terminals tied to a local area network that allows high-speed communication with the school and University’s computers, as well as with off-campus systems via NSFNet. Available software includes Parametric Technologies ProEngineer CAD and Pro/Mechanica MCAE Systems, Ansys finite element analysis package, Micro-Flow and Fluent CFD packages.
Experimental Fluid Mechanics Laboratory. This laboratory supports experimental study of a wide range of fluid flows. Equipment includes a 239-gallon glass water tank, a 524-gallon glass-walled towing tank, a high resolution digital particle image velocimetry (DPIV) system, a 2W Ar+ laser for planar laser induced fluorescence (PLIF) flow visualization and other measurement equipment for investigation of unsteady and complex fluid flows.
High-Power Laser Processing Laboratory. This laboratory provides first-hand experience in the application of high-energy light (focused laser) to process different types of materials, including forming, cutting, drilling, joining, coating and material property modification. The laboratory is equipped with a high-power MultiWave Nd:YAG laser with a power of 1 kW in CW mode and 2.5 kW in modulated mode, a fiber laser of 4 kW in power, a direct diode laser of 2kW in power and a fiber coupled diode laser of 1 kW in power, a three-axis CNC positioning system, three six-axis robots and a powerful data acquisition system for control and diagnostics.
Information Technology Laboratory.
Laser Micromachining Laboratory. This laboratory is equipped with lasers and photonics equipment for the fabrication of microscale devices and for time-resolved studies of ultrashort laser-material interactions.
Mechanics of Materials and Structure and Materials Laboratories. This laboratory is equipped for instruction and research on the mechanical behavior of materials under various loading conditions such as tension, compression and flexure as well as impact, hardness and creep. The laboratory features an Instron universal material testing system with various loading fixtures for tension-shearing and bending-stretching tests, mini- and micro-tensile testers, a micro-hardness indenter, a thermal loading chamber, a Keyance digital optical microscope and various other digital imaging units for whole-field deformation measurement applications by digital image correlation analysis.
Opto-Electronic Packaging Laboratory. This laboratory is dedicated to packaging of microelectronics and optical components and systems.
Porous Media Laboratory. This laboratory is devoted to the design, analysis and testing of porous media based systems and devices, including next generation cooling devices, filters, chemical reactors and mixers. The laboratory is equipped with instrumentation necessary for measuring effective thermo-hydraulic properties, including effective conductivity, permeability and inertia coefficient.
Solid Freeform Fabrication Laboratory. The field of rapid prototyping by Solid Freeform Fabrication (SFF) is a relatively recent by-product of the computer-integrated manufacturing revolution. SFF processes are additive in nature, in that three-dimensional, CAD geometry is fabricated by successively layering or adding two-dimensional slices of the solid. In this laboratory, high-power laser and welding processes are used to make structurally sound metallic functional parts, molds and dies. The laboratory is equipped with a laser-based cladding system, a micro-plasma powder cladding system and a welding-based deposition system. The deposition stations are incorporated with a five-axis CNC machining center and with a three-axis CNC machining center. The laboratory is equipped with the 3D ZCorp printer and a portable coordinate measuring arm for reverse engineering.
Systems, Measurement and Control Laboratories. These laboratories are equipped for instruction in the design and analysis of analog and digital instrumentation and control systems. Modern measurement and instrumentation equipment is used for experimental control engineering, system identification, harmonic analysis, simulation and real-time control applications. Equipment also exists for microprocessor interfacing for control and instrumentation and for computational and experimental research in biomechanics, dynamics and control.
Submicron Electro-Thermal Sciences Laboratory. This laboratory is dedicated to the experimental research and computational modeling of submicron integrated circuits. The laboratory features a laser-based thermo-reflectance measurement system, a microwave integrated circuit scalar performance electrical measurement system and an adaptive thermal numerical solution package.
Thermal and Fluids Laboratory. Equipment in this laboratory is used for instruction in experimental heat transfer, thermodynamics and fluid mechanics. Modern equipment is available for conducting experiments on energy conservation, aerodynamics, HVAC systems, convective cooling of electronics and heat exchangers.
Welding Laboratory. The laboratory is equipped with several fully computerized welding cells (for gas tungsten arc welding, gas metal arc welding, plasma arc welding, high power laser welding and friction stir welding) to promote high-quality research and technological innovations in arc and plasma welding.
All on-campus mechanical engineering graduate students are expected to enroll and participate each term in the ME 7090 Graduate Seminar.
7301. Entrepreneurship and Business Development in Manufacturing. A perspective on entrepreneurial thought and the necessary tools for starting a manufacturing venture. Management is the process of creating value from existing resources; in contrast, entrepreneurship is the art of creating the ideas and identifying and assembling the resources to create value. This course addresses this art for new ventures inside existing corporations and de novo start-ups in the manufacturing realm. Students learn what personality characteristics are important and effective in each of these settings and where they might fit. They learn the risks and rewards of each approach, and they acquire the tools required to develop a business plan. The course provides answers to the most frequently asked questions about entrepreneurship. Examples, exercises and cases will be drawn from a manufacturing environment.
7302. (EE 7362). Linear Systems Analysis. An introduction to the topics within the domain of modern control theory. Special emphasis on the application of the developed concepts in designing linear systems and casting their responses in prescribed forms. Covers state representation of linear systems, controllability, observability, minimal representation, linear state variable feedback, observers and quadratic regulator theory. Prerequisites: ME 4360 or permission of the instructor.
7303. Organizational Leadership. Personnel and Organizational Leadership. The scientific structure of organizations and methods used to improve the productivity and quality of life of people working in the organization. An introduction to industrial-organizational (I/O) psychology, as applied to the manufacturing organization. Focuses on understanding individual behavior and experiences in industrial and organizational settings. Introduces students to industrial psychology as it address the human resource functions of analyzing jobs and appraising, selecting, placing and training people. The organizational psychology portion of the course addresses the psychology of work, including employee attitudes, behavior, emotions, health, motivation and well-being, as well as the social aspects of the workplace.
7314. Introduction to Microelectromechanical Systems and Devices (MEMs). The basics of microelectromechanical devices and systems, including microactuators, microsensors and micromotors; principles of operation; micromachining techniques (surface and bulk micromachining); IC-derived microfabrication techniques and thin lm technologies as they apply to MEMs.
7319. Advanced Mechanical Behavior of Materials. A senior-graduate course that relates mechanical behavior on a macro-and microscopic level to design. Includes macroscopic elasticity and plasticity, viscoelasticity, yielding, yield surfaces, work hardening, geometric dislocation theory, creep and temperature-dependent and environment-dependent mechanical properties. Prerequisites: ME 2340, ME 3340 or permission of the instructor.
7320. Intermediate Dynamics. Kinematics and dynamics of particles and rigid bodies: kinematics, inertia properties. Kane’s dynamical equations. Euler’s equations of motion. D’Alembert’s principle, Lagrange’s equations of motion. Prerequisite: ME 2320 or permission of the instructor.
7321. Failure Analysis. A senior-graduate course in the evaluation of the failure of structural materials and components. Includes site examination, macroscopic examination, optical microscopy, transmission electron and SEM interpretation, examination and interpretation of failure surfaces, failure modes and causes of failure. Prerequisites: ME 3340 or permission of the instructor.
7322. Vibrations. Fundamentals of vibrations with application of simple machine and structural members. Harmonic motion, free and forced vibration, resonance, damping, isolation and transmissibility. Single, multiple and infinite degree-of-freedom systems. Prerequisites: ME 2320, MATH 2343 or permission of the instructor.
7323. Introduction to Fracture Mechanics. Linear elastic fracture mechanics, application of theory to design and evaluation of critical components: elastic stress intensity calculations, plane strain fracture toughness, plane stress and transitional behavior, crack opening displacements, fracture resistance, fatigue crack propagation, transition temperature approach to fracture control, microstructure of fracture and fracture control programs. Prerequisite: ME 2340 or permission of the instructor.
7324. Fatigue Theory and Design. A senior-graduate course. Includes continuum, statistical and fracture mechanics treatments of fatigue, stress concentrators, planning and analysis of probit, SNP and response tests, mechanisms of fatigue design, fail safe vs. safe life design and crack propagation. Emphasizes engineering design aspects of fatigue rather than theoretical mechanisms. Prerequisite: ME 3340 or permission of the instructor.
7326. Vehicle Dynamics. Modeling of wheeled vehicles to predict performance, handling and ride. Effects of vehicle center of mass, tire-characteristic traction and slip, engine characteristics and gear ratios of performance. Suspension design, steady-state handling models of four-wheeled vehicles and car-trailer systems to determine over-steer and under-steer characteristics, critical speeds and stability. Multi-degree-of-freedom ride models, including tire and suspension compliance. Computer animation and simulations. Prerequisite: ME 2320 or permission of the instructor.
7330. Heat Transfer. Application of the principles of conduction, convection and radiation heat transfer. Includes steady- and unsteady-state, special configurations, numerical and analytical solutions and design. Prerequisite: ME 3332 or permission of the instructor.
7331. Advanced Thermodynamics. Laws of thermodynamics, availability, irreversibility, real gases and mixtures, thermodynamic relations and generalized charts, combustion, chemical and phase equilibrium and computational combustion. Prerequisites: ME 2331 and ME 3341 or permission of the instructor.
7332. Heat Transfer in Biomedical Sciences. Fundamentals
of heat transfer in medicine and biology. Biothermal properties. Thermal regulation
processes. Biomedical heat transfer processes with applications in tissue laser
radiation, freezing and thawing of biological materials, cryosurgery and others. Prerequisite: ME
3332 or permission of the instructor.
333. Transport Phenomena in Porous Media. Fractals and their role in characterizing complex structures. Fundamental concepts of momentum, heat and mass transport through heterogeneous (e.g., composites, porous) materials. Emphasis on the mathematical modeling of heat and mass transfer in heterogeneous and fully saturated systems. Relevant industrial and natural applications are presented throughout the course. Prerequisite: ME 2342, ME 3332 or permission of the instructor.
7334. Fundamentals of Electronic Packaging. An introduction to micro-systems packaging, role of packaging in microelectronics, role of packaging in micro-systems, electrical package design, design for reliability, thermal management, single-chip and multi-chip packaging. IC assembly, passive devices, optoelectronics, RF packaging, MEMs, sealing and encapsulation, system-level PWBs, PWB assembly, packaging materials and processes and micro-system design for reliability.
7335. Convective Cooling of Electronics. A review the fundamentals of convection heat transfer, followed by applications of these principles to the convective cooling of electronic components and systems. Emphasizes special topics, such as heat sink design, fan and pump selection, augmentation of convection using extended surfaces, spray/jet-impingement cooling and heat pipes. Examines the design of electronic chassis with flow through coldwalls and edge-cooled PWBs.
7336. Intermediate Fluid Dynamics. Review of fundamental concepts of undergraduate fluid mechanics and an introduction to advanced fluid dynamics, industrial irrotational flow, tensor notation and the Navier-Stokes equations. Prerequisite: ME 2342 or permission of the instructor.
7337. Introduction to Computational Fluid Dynamics: Fundamentals of Finite Difference Methods. Concepts of stability, convergence, accuracy and consistency. Applications to linear and nonlinear model partial differential equations. Curvilinear grid generation. Advanced topics in grid generation. Beam and warming factored implicit technique. MacCormack techniques. Solution methods for the Reynolds equation of lubrication, the boundary layer equations and the Navier-Stokes equations. Prerequisites: ME 2342 and MATH 2343 or permission of the instructor.
7340. Introduction to Solid Mechanics. The theories of failure, principal stress and strain for solid bodies. An introduction to plate theory, elastic stability, energy methods and theory of elasticity. Torsional analysis of non-circular sections. Prerequisite: ME 2340 or permission of the instructor.
7341. Structural Properties of Solids. Designed to develop an understanding of the structural aspects of solids and their relationship to properties and applications. Topics include structural defects, bonding and crystal structure, solid-state reactions and phase transformations, degradation and deformation. Prerequisite: ME 3340 or permission of the instructor.
7342. Introduction to Thermal Management of Electronics. The thermal design of electronic packages and systems. Include the basics of conduction, convection (natural and forced) and radiation heat transfer. In addition, pool boiling and flow boiling, extended surfaces, and thermal interface resistance, as applied to the design of electronic packages. An introduction to modern cooling technologies, such as single-phase cooling and two-phase cooling, heat pipes and thermoelectric coolers.
7343. Electronic Packaging Materials: Processes, Properties and Testing. An overview of materials for electronic packaging. Examines solderability, microscopic processes and alloy selection. Looks at composites and ways to apply conducting polymer-matrix composites, metal films and vacuum processes. Covers the importance of encapsulation, temperature humidity bias testing and temperature cycle testing. Also, measurement of properties of material in electronic packaging, thermal properties, physical properties and manufacturing properties and materials selection.
7344. Conductive Cooling of Electronics. Reviews the fundamental concepts of conduction heat transfer, followed by applications of these principles to the conductive cooling of electronic components and systems. Emphasizes special topics, such as contact conductance, interface thermal resistance, heat spreaders, thermal interface materials, phase change materials and thermoelectric devices. Covers cooling of special electronic components, such as multi-chip modules, power modules, high density power supplies and printed wiring boards.
7346. Application of Computational Techniques to the Mechanical and Thermal Design of Electronic Systems. Characterizes the mechanical and thermal performance of electronic devices and systems through the use of computational techniques. Commercial codes will be used to create thermal models of systems and the design of cold plates and heat exchangers. Covers the concepts of structural modeling of components mounted on printed wiring boards in a vibration environment.
7348. Thermal, Fluid and Mechanical Measurements in Electronics. Thermal and fluid measurement topics, including need for experimentation in electronic design, use of similitude in electronics cooling, velocity, temperature and pressure measurements, thermal conductivity and thermal diffusivity measurements, heat flux measurements, flow visualization techniques and characterization of electronic components. Also covers experimental procedures used for vibration and shock testing of electronic equipment.
7350. Design for Manufacturability and Concurrent Engineering. Examines the advantages of involving both manufacturing and engineering into the early design of products and processes. Includes technical guidelines for using manufacturing processes effectively and cost determination and assessment of processing alternatives at the early design/manufacturing interface. Examines design-designing for manufacturing processing and factory capabilities as a function of quality, price performance and productivity, with emphasis on parts and process simplification, alternative methods, anticipated volumes and automated assembly.
7351. Computer Integrated Manufacturing Systems. Basic concepts and use of computer-integrated manufacturing. Includes integration approaches for manufacturing; process planning and simulation; the production process in relation to automated control systems; process design for shop floor control of multiple interacting processes; distributed network process control; real-time aspects; interface protocols and languages of production processes; computational and data processing methods for planning, design, production and shipping and methods of optimizing output quality, price and productivity. Examines economic justification and the use of artificial intelligence for planning and process control.
7352. Manufacturing Methods and Systems. Examines highly-successful manufacturing methods and systems. Includes the evolution of manufacturing technology in the United States, mass manufacturing, integrated manufacturing, distribution and manufacturing automation, just-in-time systems, continuous improvement, Kaizen, poka yoke and total quality management. Examines modern Japanese manufacturing techniques in-depth. Covers the underlying concepts and strategic benefits of flexibility, agility, time-based competition and global manufacturing operation. The course is presented from the perspective of the manufacturing manager.
7353. Manufacturing Management. New organizational structures, paradigms and leadership styles. Problem-solving within the business context: manufacturing strategies for optimizing production processes across the enterprise. Measuring and reporting business performance. Investment decision making under conditions of risk and uncertainty. Intellectual property strategies, products liability and the legal environment. Contemporary practices, including self-directed work forces, competitive assessment, total productive maintenance, managerial and activity-based costing and other topics.
7354. Lean Manufacturing and Six Sigma. An overall total quality management perspective for the design of quality management systems. Examines metrics for cycle time and defects, baselining and benchmarking and House of Quality approaches. Managing product quality from inception to deployment. Includes acquiring and stabilizing new production processes, data collection and analysis for improvement and decision making. Covers purchasing, process control and reliability in detail. Examines Taguchi, poka-yoke and other practices as tools for implementing Total Quality Management.
7355. Integrated Design and Manufacturing. Industrial performance is strongly correlated to success in integrating design and manufacturing. Examines the interrelationships between the total product realization cycle, product generation and manufacturing with the objective of improving industrial performance.
7356. Human Factors in Design and Manufacturing. A senior-graduate course that deals with human factors or ergonomics relating to designing for human use. Covers the empirical and analytical aspects of design and manufacturing as affected by the need to accommodate human use and abilities. Includes visual displays of static and dynamic information; text and graphics symbols codes; auditory, tactual and olfactory displays; speech and nonverbal communications; physical work-materials handling; motor skills and hand-tool devices and controls. Covers the workplace design, anthropometry, component arrangement in space, lighting, sound climate and motion.
7357. Optimized Mechanical Design. Principles and methods for optimal design of machine elements (spring, shafts, gears and weldments of joints, etc.) and mechanical systems (transmissions, cam systems, inertia loads and balancing, etc.). Computer applications. Prerequisite: ME 4370 or permission of the instructor.
7358. Vibration Analysis of Electronic Systems. Problems encountered in the mechanical design of electronics, particularly in the area of vibrations. Explores vibrations of simple electronic systems, component lead wires and solder joints, vibration of printed wiring boards, techniques to increase PWB fatigue life, prevention of vibration failure, design of electronics for random vibration, shock environments, effects of manufacturing methods on reliability of electronics and vibration testing. Prerequisite: ME 2340, ME 3332 or permission of the instructor.
7359. Analysis and Design of Optoelectronic Packaging. An overview of optical fiber interconnections in telephone networks, packaging for high-density optical back planes and selection of fiber technologies; semiconductor laser and optical amplifier packaging, optical characteristics and requirements, electrical properties, mechanical properties, waveguide technologies, optical alignment and packaging approaches, passive device fabrication and packaging and array device packaging; hybrid technology for optoelectronic packaging and flip-chip assembly for smart pixel arrays.
7360. Electronic Product Design and Reliability. Investigates the failures, failure modes and failure mechanisms in electronic systems. Covers failure detection, electrical simulation and environmental stress tests. Also, failure analysis, including the use of X-rays, thermal imaging/infrared microscopy, accoustical imaging, scanning laser acoustic microscopy, infrared spectroscopy, differential scanning calorimeter, thermo-mechanical analyzer and other testing procedures. In addition, solder joint reliability of balls grid array (BGA) assemblies, plastic ball grid array (PBGA) assemblies, flip-chip assemblies, chip-scale package (CSP) assemblies and fine pitch, surface mount technology (SMT) assemblies. Temperature as a reliability factor, an overview of high temperature electronics, the use of silicon devices at high temperatures and selection of passive devices for use at high temperatures.
7361. Matrix Structural Analysis. A systematic approach to formulation of force and displacement method of analysis, representation of structures as assemblages of elements and computer solution of structural systems. Prerequisite: Permission of the instructor.
7362. Engineering Analysis with Numerical Methods. Applications of numerical and approximate methods in solving a variety of engineering problems. Include equilibrium, buckling, vibration, fluid mechanics, thermal science and other engineering applications. Prerequisite: Permission of the instructor.
7363. Electronic Manufacturing Technology. Covers the complete field of electronics manufacturing. Includes an introduction to the electronics industry, electronic components, the theory and methods of manufacture of solid state devices, packaging techniques such as wire bonding flip chip and TAB, printed wiring board, soldering and solderability, leaded and surface mounted components, electromagnetic interference, electrostatic discharge prevention, testability and electronic stress screening. Discusses, in each area, the current technology as well as leading edge tools.
7364. Introduction to Structural Dynamics. Dynamic responses of structures and behavior of structural components to dynamic loads and foundation excitations, single- and multi-degree-of-freedom systems response and applications to analysis of framed structures and introduction to systems with distributed mass and flexibility. Prerequisites: ME 8361 and MATH 2343 or permission of the instructor.
7365. Strategies for Manufacturing. The development and implementation of strategies for product design and manufacturing that best support the overall strategy of the firm. Includes positioning the product and production system in the industry, location and capacity decision, implementing manufacturing technologies, facilities planning, vertical integration, logistics planning and organizational culture. Uses case studies of manufacturing firms extensively.
7366. Global Manufacturing. Goals and strategies for manufacturing operations in the multinational environment. Includes decision making for decentralizing and setting up foreign manufacturing operations; marketing, sales and distribution strategies; R&D support; location and capacity decisions; implementing new manufacturing technologies; facilities planning and modernizations; vertical integration; outsourcing strategies; logistics planning and organizational cultures. Uses case studies of manufacturing firms.
7368. Project and Risk Management. Specific concepts, techniques and tools for managing projects successfully. Network planning techniques, resource allocation, models for multi-project scheduling and methods of controlling costs, determining schedules and performance parameters. The basics of risk management, including hard analysis, risk analysis, risk control and risk financing. The focus of the course is to integrate risk assessment with managerial decision making. Emphasizes examples and case studies.
7369. Innovation Management. In the face of rapid technological growth and innovation, a disciplined management approach is necessary to assure a reasonable expectation of success. Examines the factors of proper selection, justification and implementation of new technologies within the framework of consumer electronics, advanced materials and emerging information capabilities, expert systems and machine tool industry. Includes technological forecasting risk and uncertainty and project management.
7371. Gas Dynamics and Design of Propulsion Systems. One-dimensional compressible flow, linearized two-dimensional flow method of characteristics and oblique shocks. Design of air-breathing propulsion systems components: inlets, nozzles, compressors, turbines and combustors. Interactions with the external flow. Prerequisites: ME 2342 and ME 3341 or permission of the instructor.
7372. Introduction to CAD/CAM. Introduction to mechanical computer-aided design (CAD). Survey of technical topics related to CAD and computer-aided manufacturing (CAM). Emphasis on the use of interactive computer graphics in modeling, drafting, assembly and analysis. Extensive hands-on use of
7376. Robotics – Introduction to Computer-Aided Manufacturing (CAM). Introduction to industrial robotics and numerically controlled machines. Economics of CAM. Applications of robotics in industry. Robot safety. Addition of senses and intelligence. Research in CAM. Flexible manufacturing cells and systems. Hands-on laboratory work with industrial robots and NC machines. Independent study and report on a specific robot application. Prerequisites: PHYS 1301, MATH 2343 and CSE 1341 or permission of the instructor.
7382 Finance and the Manufacturing Enterprise. An overview of strategic management decision processes relevant to engineering, manufacturing and service industries. The targeted student is the current or future professional engineer-manager, engineer-owner and/or engineer-entrepreneur who combine engineering/manufacturing technology with business execution. Emphasis on how engineering and manufacturing managerial functions interact with the finance industry, markets and institutions.
7383. Heating, Ventilating and Air Conditioning. Selection and design of basic refrigeration, air conditioning and heating systems. Includes load calculations, psychometrics, cooling coils, cooling towers, cryogenics, solar energy applications and special topics. Prerequisites: ME 2331 and ME 3332 or permission of the instructor.
7386. Convection Heat Transfer. Advanced topics in forced convection heat transfer using analytical methods and boundary-layer analysis. Laminar and turbulent flow inside smooth tubes and over external surfaces. Convection processes in high-speed flows. Prerequisite: ME 3332 or permission of the instructor.
7090. Graduate Seminar. Lectures by invited speakers from industry and academia and SMU faculty and students on research topics of current interest in civil engineering, mechanical engineering and engineering mechanics. All students, staff and faculty are invited.
7190. Seminar Series on Ethics in Engineering and Technology. A one-hour course that covers ethical issues, hard choices and human failures in life. Discusses practical, ethical issues with examples from everyday life. Includes ethical issues encountered in copyright law and intellectual property, along with issues involved in telephone communications and e-mail. Discusses principles, methods and bases for ethical decision making and action.
8338. Viscous Flow Theory. A study of the motion of viscous fluids, low Reynolds number and laminar boundary-layer theory for a Newtonian fluid and exact and approximate methods for solution of problems. Prerequisite: ME 2342 or permission of the instructor. Corequisite: MATH 6333 or permission of the instructor.
8339. Turbulent Shear Flow. A study of real turbulent flows; flow stability, transition and turbulence structure; free shear, pipe and boundary layer flows; effects of surface conditions, blowing and suction, pressure gradients and compressibility; approximate solution methods and atmosphere shear flows. Prerequisite: ME 8338 or permission of the instructor.
8340. Theory of Elasticity. The study of stress, strain and stress-strain relationships for elastic bodies. Classical solutions of two- and three-dimensional problems. The use of the Airy stress function. Prerequisite: ME 7340 or permission of the instructor.
8342. Theory of Plasticity. Physical basis of plastic deformation and mathematical theory of yield and plastic flow with applications to various engineering problems. Prerequisite: Permission of the instructor.
8344. Energy Methods in Applied Mechanics. Discusses the variational energy principles of mechanics and applies them to analysis of beams and trusses, general elasticity problems, plates and shells, buckling and dynamics. Prerequisite: ME 7340 or permission of the instructor.
8346. Mechanics of Composite Materials. Introduction to analysis of composite material behavior, including stiffness and strength relations for a lamina and for laminates and the effect of lamination on deflection, buckling and vibration of plates. Prerequisite: ME 7340 or permission of the instructor.
8361. (EE 8361). Multivariable Control System Design. Introduction to multivariable systems. State determined control systems. Polynomial algebras and matrices. Traditional fraction representation. Feedback, sensitivity and stabilization. Sensitivity integrals. Introduction to H¥, m and QFT control design. Interaction indices and H-matrices. Design examples. Prerequisite: ME 4360 or permission of the instructor.
8364. Finite Element Methods in Structural and Continuum Mechanics. Theory and application of finite element, two- and three-dimensional elements, bending elements, applications to buckling and dynamic problems. Prerequisite: ME 7361 or permission of the instructor.
8366. Basic Concepts of Structural Stability. Unified approach to elastic buckling analysis of columns, plates and shells using variational calculus (developed entirely in the course). Prerequisite: ME 7340 or permission of the instructor.
8367. (EE 8367). Nonlinear Control. An introduction to methods of the control of nonlinear systems. Reviews phase plane analysis of nonlinear systems, Lyapunov theory, nonlinear stability and describing function analysis. Advance control techniques, including feedback linearization, sliding control and adaptive control. Special emphasis on the application of the developed concepts to the robust regulation of the response of nonlinear systems. Prerequisite: ME 7302/EE 7362 or permission of the instructor.
8368. Theory of Plate Behavior. Analysis of flat plates subjected to normal loading, inplane loading and thermal stresses. Analyzes plates of various shapes, thick plates and anisotropic plates for both small and large deflections. Prerequisite: ME 7340 or permission of the instructor.
8369. Theory of Shell Behavior. Membrane and bending theories of cylindrical shells, shells of revolution and translational shells and their application to various problems in aerospace, manufacturing and construction industries. Prerequisite: ME 7340 or permission of the instructor.
8385. Conduction Heat Transfer. Analytical and numerical methods as applied to several cases of steady- and unsteady-state conduction. Includes temperature dependent properties, multidimensional system and heat sources.
8387. Radiation Heat Transfer. Basic laws and definitions of thermal radiation. Radiation properties of surfaces. Basic equations for energy transfer in absorbing, emitting and scattering media. Applications to combined conduction-radiation and convection-radiation problems. Prerequisite: ME 3332 or permission of the instructor.
7(0,1,2,3,6)96. Master’s Thesis. Variable credit, but no more than six term hours in a single term and not more than four in a summer term. Enrollment in several sections may be needed to obtain the desired number of thesis hours. For example, four term hours of thesis would require enrollment in ME 7396 and ME 7196.
7(1-4)9(4-5). Selected Problems. Independent investigation of problems and projects in mechanical engineering approved by the department chair and the instructor (on request).
7384. Advanced Topics II. Advanced selected topics in mechanical engineering and its application (on request).
7(1-9)9(0-3). Selected Topics. Independent investigation of problems and projects in mechanical engineering approved by the department chair and the major professor (on request).
8(0,1,6,9)96. Dissertation. Variable credit, but no more than 15 term hours in a single term and not more than 10 term hours in a summer terms. Enrollment in several sections may be needed to obtain the desired number of dissertation hours. For example, 12 term hours of dissertation would require enrollment in ME 8390 and ME 8990.
8(1-9)9(0-4). Selected Topics. Individual or group study of selected topics in mechanical engineering approved by the department chair and the instructor (on request).
Courses reflecting specific areas of interest are listed below. These courses have not been taught on a regular basis and may be offered if sufficient interest is shown.
8320. Advanced Dynamics.
8325. Random Vibrations. Fundamentals of random vibrations, statistical analysis, frequency response, spectral density, autocorrelation, Fourier methods and applications. Prerequisite: ME 7322 or permission of the instructor.
8326. Vibrations of Elastic Bodies. The study of impact and vibrations of continuous, elastic bodies: free and forced vibrations of bars, beams and plates for various boundary conditions. Prerequisite: ME 7322 or permission of the instructor.
8327. Wave Propagation in Continuous Media. Review of vibration theory in discrete and continuous media, stress waves in solids, transmission phenomena and pressure waves in fluids. Prerequisites: ME 7322 and MATH 2343 or permission of the instructor.
© Southern Methodist University, Dallas, Texas | Legal Disclosures | A-Z Site Index | Contact SMU
Share